2014年4月15日星期二

plc cpu modules in cooling technology analysis

To ensure job stability and prolong the use life of the chip may not exceed the maximum temperature 85 ℃ [2]. Device operating temperature is increased by 10 ℃, its failure rate doubling [ 3 ] . In order to ensure the normal operation of electronic equipment safe and reliable long-term operation of the resistance, the use of appropriate , reliable way to control the temperature of electronic components , plc cpu modules make it work in the  programmable logic controller manufacturer environmental conditions in which the stable operation of the request does not exceed the maximum temperature . With the heat flux miniaturization of electronic components , micro- miniaturization, high integration of integrated circuits and micro- assembly is carried out , components, assemblies progress from time to time , the thermal design are also facing a severe challenge. The quality of construction of thermal power supply system can directly affect the long time stability . Heat transfer and flow brawn to school for the foundation , separate detailed structure of electronic equipment , rational and efficient design of programmable controller  the cooling installation , combined with advanced thermal analysis software simulation research, electronic devices invented a good working environment to ensure that heating components and power systems at a stable temperature can be allowed to work securely DC / DC power module thermal analysis process 1 ) analysis of the power supply circuit corresponding thermal circuit , plc cpu modules will certainly heat transfer pathway , draw the equivalent thermal model . 2 ) a power supply circuit configured to analyze planning , and certainly the main heating elements . 3 ) Application LSL establish a 3D model of the power supply of the radiator, then the application of  plc controller professional thermal simulation software EFD.Pro, based on current science and brawn numerical heat transfer theory , the practice of separating the thermal boundary conditions , stop the simulation model to establish imitation .
4 ) Stop the simulation results analysis . After stopping the simulation model to imitate , mimic the results of its analysis of whether the power fit to work requests.

没有评论:

发表评论